ANALYZING MECHANICAL PROPERTIES OF TRANSIENT LIQUID PHASE BONDING OF AL2O3 P/AL NANOCOMPOSITE USING COPPER INTERLAYER

Q: How can I download an article?

To download an article from SID, first log in to the site, search for the article title, and click on the 'Download Article' option.

Q: How can I download an ISI article?

To download an ISI article on SID, enter the keyword or article title in the search bar, view the relevant results, click on the desired article, and select the 'Download Article' option.

Q: How can I access the SID database?

To access the SID database, visit SID.ir, create an account, and log in to access scientific resources.

Q: Is downloading articles from SID free?

Some articles on SID are available for free, while others require payment. Details are specified on the article's page.

SAYYEDAIN S.S.; SALIMIJAZI H.R.; TOROGHINEJAD M.R.; KARIMZADEH F.

مرکز اطلاعات علمی Scientific Information Database (SID) - Trusted Source for Research and Academic Resources

Journal Paper

Paper Information

Journal: ADVANCED MATERIALS IN ENGINEERING (ESTEGHLAL) Year:2014 | Volume:33 | Issue:1 Page(s): 63-76

Download Full-Text

Persian Verion

View:

668

Download:

Cites:

Information Journal Paper

Title

ANALYZING MECHANICAL PROPERTIES OF TRANSIENT LIQUID PHASE BONDING OF AL2O3 P/AL NANOCOMPOSITE USING COPPER INTERLAYER

Author(s)

SAYYEDAIN S.S. | SALIMIJAZI H.R. | TOROGHINEJAD M.R. | KARIMZADEH F. | Issue Writer Certificate

Keywords

AL MATRIX NANOCOMPOSITEQ2

TLP DIFFUSION BONDINGQ2

ISOTHERMAL SOLIDIFICATIONQ2

MICROSTRUCTUREQ2

Abstract

Due to their superior properties such as high specific strength, high creep resistance and high strength at elevated temperatures, aluminum composites reinforced with alumina nano particles are widely used for advanced purposes such as aerospace and auto industries. Lack of an appropriate welding process limits their applications. Transient liquid phase (TLP) bonding is one of the state-of-the-art joining processes. It is used for welding composites and advanced materials. MICROSTRUCTURE and mechanical properties of TLP bonding depend on the bonding time and temperature. In the current study, the effect of bonding time on the MICROSTRUCTURE and bonding strength of the TLP diffusion bonded of Al2O3 p/Al nanocomposite was investigated. A thin layer of copper deposited by electroplating was used as an interlayer. The bonding times of 20 and 40 min were not sufficient for completing the ISOTHERMAL SOLIDIFICATION, and the bonding strengths were not satisfactory. By increasing the bonding time to 60 min at constant bonding temperature of 580oC, the ISOTHERMAL SOLIDIFICATION was completed and the final joint MICROSTRUCTURE consisted of softα-Al phase with dispersed CuAl2 precipitated particles. Decreasing the amount of brittle eutectic structures in the joint seam by increasing the bonding time was the main reason for improvement of the joint shear strength. The maximum joint shear strength was achieved at 580oC for 60 min which was about 85% of the shear strength of the base material.

Cites

No record.

References

No record.

Cite

APA: Copy

SAYYEDAIN, S.S., SALIMIJAZI, H.R., TOROGHINEJAD, M.R., & KARIMZADEH, F.. (2014). ANALYZING MECHANICAL PROPERTIES OF TRANSIENT LIQUID PHASE BONDING OF AL₂O₃ ^P/AL NANOCOMPOSITE USING COPPER INTERLAYER. ADVANCED MATERIALS IN ENGINEERING (ESTEGHLAL), 33(1), 63-76. SID. https://sid.ir/paper/163265/en

Vancouver: Copy

SAYYEDAIN S.S., SALIMIJAZI H.R., TOROGHINEJAD M.R., KARIMZADEH F.. ANALYZING MECHANICAL PROPERTIES OF TRANSIENT LIQUID PHASE BONDING OF AL₂O₃ ^P/AL NANOCOMPOSITE USING COPPER INTERLAYER. ADVANCED MATERIALS IN ENGINEERING (ESTEGHLAL)[Internet]. 2014;33(1):63-76. Available from: https://sid.ir/paper/163265/en

IEEE: Copy

S.S. SAYYEDAIN, H.R. SALIMIJAZI, M.R. TOROGHINEJAD, and F. KARIMZADEH, “ANALYZING MECHANICAL PROPERTIES OF TRANSIENT LIQUID PHASE BONDING OF AL₂O₃ ^P/AL NANOCOMPOSITE USING COPPER INTERLAYER,” ADVANCED MATERIALS IN ENGINEERING (ESTEGHLAL), vol. 33, no. 1, pp. 63–76, 2014, [Online]. Available: https://sid.ir/paper/163265/en

Related Journal Papers