EFFECT OF USING ELECTRIC CURRENT DURING DENTIN BONDING AGENT APPLICATION ON MICROLEAKAGE UNDER SIMULATED PULPAL PRESSURE CONDITION

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GHARIZADEH NAGHMEH; KAVIANI AZITA; NIKBAKHT SAMANEH

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Journal: Dental Research Journal Year:2010 | Volume:7 | Issue:1 Page(s): 23-27

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Title

EFFECT OF USING ELECTRIC CURRENT DURING DENTIN BONDING AGENT APPLICATION ON MICROLEAKAGE UNDER SIMULATED PULPAL PRESSURE CONDITION

Author(s)

GHARIZADEH NAGHMEH | KAVIANI AZITA | NIKBAKHT SAMANEH | Issue Writer Certificate

Keywords

DENTAL LEAKAGE

DENTAL PULP

DENTIN-BONDING AGENTS

ELECTRIC CURRENT

Abstract

Background: The use of ELECTRIC CURRENT during application of etch-and-rinse adhesive systems has been recently introduced to decrease microleakage. This study investigated the effects of an electric field produced by an experimental device for the application of a two-step etch-and-rinse adhesive on moist dentin surface.Methods: Sixty freshly extracted human premolars were used for this study. In order to simulate real conditions, the pulpal pressure was set to 35 cm H2O for all the specimens. The teeth were divided into two groups: in group I, etch-and-rinse system (Single Bond) was applied with ELECTRIC CURRENT while group II, etch-and-rinse system (Single Bond) was applied without ELECTRIC CURRENT. Specimens were prepared for dye penetration test. The data were analyzed using Mann-Whitney U test.Results: The results showed that group I had less microleakage scores compared to group II (P=0.047).Conclusion: Based on the result of this study, it could be concluded that using ELECTRIC CURRENT for applying adhesive systems had a significant effect on reducing microleakage.

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APA: Copy

GHARIZADEH, NAGHMEH, KAVIANI, AZITA, & NIKBAKHT, SAMANEH. (2010). EFFECT OF USING ELECTRIC CURRENT DURING DENTIN BONDING AGENT APPLICATION ON MICROLEAKAGE UNDER SIMULATED PULPAL PRESSURE CONDITION. DENTAL RESEARCH JOURNAL, 7(1), 23-27. SID. https://sid.ir/paper/325014/en

Vancouver: Copy

GHARIZADEH NAGHMEH, KAVIANI AZITA, NIKBAKHT SAMANEH. EFFECT OF USING ELECTRIC CURRENT DURING DENTIN BONDING AGENT APPLICATION ON MICROLEAKAGE UNDER SIMULATED PULPAL PRESSURE CONDITION. DENTAL RESEARCH JOURNAL[Internet]. 2010;7(1):23-27. Available from: https://sid.ir/paper/325014/en

IEEE: Copy

NAGHMEH GHARIZADEH, AZITA KAVIANI, and SAMANEH NIKBAKHT, “EFFECT OF USING ELECTRIC CURRENT DURING DENTIN BONDING AGENT APPLICATION ON MICROLEAKAGE UNDER SIMULATED PULPAL PRESSURE CONDITION,” DENTAL RESEARCH JOURNAL, vol. 7, no. 1, pp. 23–27, 2010, [Online]. Available: https://sid.ir/paper/325014/en

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