OHMIC CONTACT OF CU/MO AND CU/TI THIN LAYERS ON MULTI-CRYSTALLINE SILICON SUBSTRATES

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DEHGHAN NAYERI F.; ESFANDYARPOUR B.; BEHNAM A.; ASL SOLEYMANI E.; MOHAJER ZADEH SH.; MALEKI M.H.

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Paper Information

Journal: Iranian Journal of Chemistry and Chemical Engineering Year:2007 | Volume:26 | Issue:3 Page(s): 55-59

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Information Journal Paper

Title

OHMIC CONTACT OF CU/MO AND CU/TI THIN LAYERS ON MULTI-CRYSTALLINE SILICON SUBSTRATES

Author(s)

Keywords

CU-MO CONTACT

CU-TI CONTACT

OHMIC CONTACT

RESISTIVITY

Abstract

Cu-Mo and CU-TI CONTACT structures were fabricated on multi-crystalline silicon substrates to provide a low resistance OHMIC CONTACT. Deposition steps are done in an excellent vacuum chamber by means of electron beam evaporation and samples are then annealed for the realization of an efficient alloy layer. The effects of process parameters such as film thickness, annealing duration and temperature on the contact quality have been investigated and optimized for achieving the best special contact RESISTIVITY. The specific contact resistance obtained for Cu-Mo and Cu-Ti structures were 8.58x10-6 W-cm2 and 9.72x10-6 W-cm2, respectively. Finally, between the two proposed structures a comparison has been made which is resulted in the selection of CU-MO CONTACT as the better structure due to its less resistance and better adhesion to the substrate.

Cites

ASSESSING HEAVY METAL CONTENT OF MUSCLE TISSUE AND CAVIAR OF ACIPENSERPERSICUS AND ACIPENSER STELLATUS IN SOUTHERN CASPIAN SEA

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APA: Copy

DEHGHAN NAYERI, F., ESFANDYARPOUR, B., BEHNAM, A., ASL SOLEYMANI, E., MOHAJER ZADEH, SH., & MALEKI, M.H.. (2007). OHMIC CONTACT OF CU/MO AND CU/TI THIN LAYERS ON MULTI-CRYSTALLINE SILICON SUBSTRATES. IRANIAN JOURNAL OF CHEMISTRY AND CHEMICAL ENGINEERING (IJCCE), 26(3), 55-59. SID. https://sid.ir/paper/408291/en

Vancouver: Copy

DEHGHAN NAYERI F., ESFANDYARPOUR B., BEHNAM A., ASL SOLEYMANI E., MOHAJER ZADEH SH., MALEKI M.H.. OHMIC CONTACT OF CU/MO AND CU/TI THIN LAYERS ON MULTI-CRYSTALLINE SILICON SUBSTRATES. IRANIAN JOURNAL OF CHEMISTRY AND CHEMICAL ENGINEERING (IJCCE)[Internet]. 2007;26(3):55-59. Available from: https://sid.ir/paper/408291/en

IEEE: Copy

F. DEHGHAN NAYERI, B. ESFANDYARPOUR, A. BEHNAM, E. ASL SOLEYMANI, SH. MOHAJER ZADEH, and M.H. MALEKI, “OHMIC CONTACT OF CU/MO AND CU/TI THIN LAYERS ON MULTI-CRYSTALLINE SILICON SUBSTRATES,” IRANIAN JOURNAL OF CHEMISTRY AND CHEMICAL ENGINEERING (IJCCE), vol. 26, no. 3, pp. 55–59, 2007, [Online]. Available: https://sid.ir/paper/408291/en

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