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Information Journal Paper

Title

MICROTENSILE BOND STRENGTH OF CLEARFIL SE BOND TO CARIES-AFFECTED DENTIN AND NORMAL DENTIN

Pages

  8-14

Abstract

 Background and Aim: Bonding systems have been traditionally used on NORMAL DENTIN, even though caries-affected and sclerotic dentin is often the clinically relevant bonding substrates. A self-etching primer adhesive system (Clearfil SE Bond) was evaluated for its ability to bond to caries-affected and NORMAL DENTIN.Materials and Methods: In this experimental study, twelve extracted human primary molars with occlusal caries were selected. The enamel and superficial dentin were ground with a diamond disk and stained with a caries detector solution (propylen glycol and 1% acid red). The red-stained soft dentin which was classified as infected dentin was excavated and the AFFECTED DENTIN and surrounding NORMAL DENTIN were polished with a 600 grit silicon carbide paper under running water to achieve a flat surface. The entire flat surface was bonded with Clearfil SE Bond (Kuraray) according to the manufacturer's instructions and covered with composite resin Clearfil AP-X (Kuraray) to form a composite crown, approximately 4.5 mm high. The teeth were stored in distilled water at room temperature for 24 hours and were then sectioned with a diamond saw under running water in both X and Y directions, perpendicular to the bonded surface with dimensions of approximately 0.8-1 mm, so that the bonded areas of the affected or NORMAL DENTIN were isolated. The obtained rods were divided into two groups: Affected and sound dentin. After measuring the cross-sectional areas at the interface, the specimens were mounted in a MICROTENSILE tester machine and pulled under tension to failure. The mode of failure was evaluated using a stereomicroscope and the data were analyzed by t-test.Results: Statistical analysis indicated that the MICROTENSILE bond strength in AFFECTED DENTIN (21.53±6.52MPa) was significantly lower (p<0.05) than NORMAL DENTIN (26.98±7.31MPa).Conclusion: The studied self-etch system, attained lower MICROTENSILE bond strength in AFFECTED DENTIN as compared to NORMAL DENTIN.

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    APA: Copy

    GHASEMI, A., BARGRIZAN, M., & MAHMOUDI, M.. (2006). MICROTENSILE BOND STRENGTH OF CLEARFIL SE BOND TO CARIES-AFFECTED DENTIN AND NORMAL DENTIN. JOURNAL OF IRANIAN DENTAL ASSOCIATION (JIDA) (MAJALLAH-I-DANDANPIZISHKI), 18(2 (59)), 8-14. SID. https://sid.ir/paper/55184/en

    Vancouver: Copy

    GHASEMI A., BARGRIZAN M., MAHMOUDI M.. MICROTENSILE BOND STRENGTH OF CLEARFIL SE BOND TO CARIES-AFFECTED DENTIN AND NORMAL DENTIN. JOURNAL OF IRANIAN DENTAL ASSOCIATION (JIDA) (MAJALLAH-I-DANDANPIZISHKI)[Internet]. 2006;18(2 (59)):8-14. Available from: https://sid.ir/paper/55184/en

    IEEE: Copy

    A. GHASEMI, M. BARGRIZAN, and M. MAHMOUDI, “MICROTENSILE BOND STRENGTH OF CLEARFIL SE BOND TO CARIES-AFFECTED DENTIN AND NORMAL DENTIN,” JOURNAL OF IRANIAN DENTAL ASSOCIATION (JIDA) (MAJALLAH-I-DANDANPIZISHKI), vol. 18, no. 2 (59), pp. 8–14, 2006, [Online]. Available: https://sid.ir/paper/55184/en

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