Information Journal Paper
APA:
CopyCHIN, Y.K., NORDLUND, E., & STATON, D.A.. (2003). THERMAL ANALYSIS LUMPED-CIRCUIT MODEL AND FINITE ELEMENT ANALYSIS. PROCEEDING OF INTERNATIONAL OF POWER ENGINEERING CONFERENCE, -(-), 435-440. SID. https://sid.ir/paper/612947/en
Vancouver:
CopyCHIN Y.K., NORDLUND E., STATON D.A.. THERMAL ANALYSIS LUMPED-CIRCUIT MODEL AND FINITE ELEMENT ANALYSIS. PROCEEDING OF INTERNATIONAL OF POWER ENGINEERING CONFERENCE[Internet]. 2003;-(-):435-440. Available from: https://sid.ir/paper/612947/en
IEEE:
CopyY.K. CHIN, E. NORDLUND, and D.A. STATON, “THERMAL ANALYSIS LUMPED-CIRCUIT MODEL AND FINITE ELEMENT ANALYSIS,” PROCEEDING OF INTERNATIONAL OF POWER ENGINEERING CONFERENCE, vol. -, no. -, pp. 435–440, 2003, [Online]. Available: https://sid.ir/paper/612947/en