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Information Journal Paper

Title

LPCVD DEPOSITION OF TIN OXIDE THIN FILMS

Pages

  1-6

Keywords

Not Registered.

Abstract

 A novel design for a low pressure chemical vapor deposition (LPCVD) system, used for the deposition of tin oxide thin films, is presented. The system is cost-effective and provides control on all the major parameters of the deposition process. A solution of SnCl4 in distilled water is used as a precursor. The precursor solution is located inside the low pressure chamber and the system has no input during the deposition process. The evaporation rate is controlled by the amount of precursor dropped on a temperature controlled hot plate. The substrate temperature can be varied from room temperature up to 600°C. The pressure of the chamber could be adjusted by the calibration of a multi-valve evacuation control unit installed between the chamber and the rotary pump employed. Deposition of uniform SnO2 thin films in the thickness range of 50-400 nm was achieved. The maximum surface conductivity of the undoped Sno2 layers was 10-3 moh. . Above 10-4 moh., conductance reproducibility of ±10% was achieved.

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    Cite

    APA: Copy

    SADRAIE, A.R., ORVATINIA, M., & HOSSEIN BABAEI, F.. (2006). LPCVD DEPOSITION OF TIN OXIDE THIN FILMS. INTERNATIONAL JOURNAL OF INDUSTRIAL ENGINEERING AND PRODUCTION MANAGEMENT (IJIE) (INTERNATIONAL JOURNAL OF ENGINEERING SCIENCE) (PERSIAN), 17(1), 1-6. SID. https://sid.ir/paper/65885/en

    Vancouver: Copy

    SADRAIE A.R., ORVATINIA M., HOSSEIN BABAEI F.. LPCVD DEPOSITION OF TIN OXIDE THIN FILMS. INTERNATIONAL JOURNAL OF INDUSTRIAL ENGINEERING AND PRODUCTION MANAGEMENT (IJIE) (INTERNATIONAL JOURNAL OF ENGINEERING SCIENCE) (PERSIAN)[Internet]. 2006;17(1):1-6. Available from: https://sid.ir/paper/65885/en

    IEEE: Copy

    A.R. SADRAIE, M. ORVATINIA, and F. HOSSEIN BABAEI, “LPCVD DEPOSITION OF TIN OXIDE THIN FILMS,” INTERNATIONAL JOURNAL OF INDUSTRIAL ENGINEERING AND PRODUCTION MANAGEMENT (IJIE) (INTERNATIONAL JOURNAL OF ENGINEERING SCIENCE) (PERSIAN), vol. 17, no. 1, pp. 1–6, 2006, [Online]. Available: https://sid.ir/paper/65885/en

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