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Information Journal Paper

Title

Int-TAR: An Intelligent Thermal-Aware Packet Routing Algorithm for 3D NoCs

Pages

  47-56

Abstract

 Background and Objectives: Thermal problem is one of the main challenges in 3D on-chip networks. Inappropriate traffic distribution, poor heat dissipation, cooling restriction for layers away from the chip heatsink are the main reasons for this problem. Methods: This paper proposes a new intelligent Routing algorithm called (IntTAR) to solve these problems. Int-TAR applies a routing for managing the heat in 3D on-chip networks dynamically. The main idea behind Int-TAR is to save the past states of the system and, according to these states, predict the future behavior of the network and perform routing dynamically. It is done by the threshold of routers dynamically based on the current status of the routers. Results: The simulation results show that Int-TAR decreases the temperature of the network by 13% and improves performance efficiently. Conclusion: The proposed idea shows the better benchmark for the Thermal problem in 3D on-chip network. Also, the higher memory for storing the past state of the network can make accurate and the further performance for the network.

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  • Cite

    APA: Copy

    SHIRMOHAMMADI, Z., MAHMOUDI, M.J., & Rostamnejad, M.. (2022). Int-TAR: An Intelligent Thermal-Aware Packet Routing Algorithm for 3D NoCs. JOURNAL OF ELECTRICAL AND COMPUTER ENGINEERING INNOVATIONS, 10(1), 47-56. SID. https://sid.ir/paper/974007/en

    Vancouver: Copy

    SHIRMOHAMMADI Z., MAHMOUDI M.J., Rostamnejad M.. Int-TAR: An Intelligent Thermal-Aware Packet Routing Algorithm for 3D NoCs. JOURNAL OF ELECTRICAL AND COMPUTER ENGINEERING INNOVATIONS[Internet]. 2022;10(1):47-56. Available from: https://sid.ir/paper/974007/en

    IEEE: Copy

    Z. SHIRMOHAMMADI, M.J. MAHMOUDI, and M. Rostamnejad, “Int-TAR: An Intelligent Thermal-Aware Packet Routing Algorithm for 3D NoCs,” JOURNAL OF ELECTRICAL AND COMPUTER ENGINEERING INNOVATIONS, vol. 10, no. 1, pp. 47–56, 2022, [Online]. Available: https://sid.ir/paper/974007/en

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