Soldering plays a crucial role in the electronics industry, driving the need for constant improvements in physical and mechanical properties and the management of intermetallic compound formation. Research in composite materials aims to achieve a uniform distribution of reinforcing particles within solder matrix to enhance their performance. This study investigates the integration of cobalt microparticles into SAC0307 lead-free soft solder alloy using the accumulative roll bonding (ARB) method. Microstructural analysis confirmed a homogeneous dispersion of cobalt particles within the solder after three ARB passes. Moreover, increasing cobalt content led to a reduction in the size of Cu6Sn5 intermetallic compounds, from 9 µm to 5 µm with 1% cobalt by weight. Examination of β-Sn grain morphology revealed the impact of cobalt particles on recovery and recrystallization kinetics in the solder. Mechanical testing indicated a 20% decrease in interlayer strength within composite solder sheets. Tensile tests showed a 28% increase in strength and a 31% decrease in elongation for composite solder alloy containing 1% cobalt. Differential scanning calorimetry (DSC) results revealed minimal change in the melting temperature of composite solder foil.

In this research, the effects of two kinds of additives in Barium Titanate ceramics were studied, in order to related the Microstructure to electrical properties of the system. In the first series, the effects of Cerium (as a dopant) and in the second series the effects of Cerium along with lead on the electrical properties (with emphasis on the PTCR behavior) were evaluated. The amount of Ce was changed from 0.1% to 0.5% mole and the amount of Pb was 30% which was considered to be substituted to Ba sites. The first series were sintered from 1100 °C to 1350 °C and the second ones from 1100 °C to 1300 °C. After polishing and coating, the electrical properties were measured and analyzed. The results showed that Ce doping lowers the resistance of the systems (in both cases, without and with Pb) up to 0.3% mole and increased after that. The addition of Pb had increased the Tc of the system. The optimal sintering temperatures were about 1350 °C and 1200 °C in the first and second series respectively. In the first series, the Tc was about 125 °C and in the second series 180-200 °C. X-ray diffractometry showed that in the first series, the dominant phase was pure Barium Titanate and in the second series Barium Lead Titanate.

In this study effect of flour hydration was investigated on gluten development in bread dough. For this purpose, zero-mechanical energy developed (ZD) doughs, which prepared and hydrated outside conventional mixers were used. Effects of fridge and room temperatures for different durations (1.5, 4 and 24 h) were studied on dough hydration extent and gluten development. Epi-fluorescence light microscopic (EFLM) observations revealed positive effect of holding time in both temperatures on protein distribution extent in dough Microstructure. However, increasing temperature for durations studied showed strong effect on hydration and hence gluten development extent. So, treatments carried out at room temperature for 24 h compared to those accomplished at fridge temperature for the same duration showed the best gluten development patterns. Concluding, flour hydration leads to development of gluten structures in the dough. Gluten self-aggregation caused by hydration accounts for this phenomenon. However, the structures observed for ZD doughs in this study were different from those reported for optimally-mixed doughs, which show coarse interconnected gluten network surrounding starch granules.