Introduction: Laser tissue Soldering using albumin and indocyanine green dye (ICG) is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser Soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a) using a temperature controlled infrared detector or (b) by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice.Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426) were significantly better than the control samples (340.5).Conclusion: Tissue feedback control of temperature and optical changes in laser Soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

Background: Fumes generating during Soldering process are a group of metal vapors and gases such as tin, lead and formaldehyde which are one of the main reasons for lung diseases in solders. Respiratory epithelium in trachea is the first biological barrier which responds to these fumes. The aim of this study was to identify the quantitative effects of these fumes in respiratory epithelium of rats.Materials and Methods: A total number of 48 adult male Sprague Dawley rats were randomly divided into experimental (n=30) and control (n=18) groups. Each group was subdivided into 2, 4 and 6-week subgroups based on the time of tissue sampling. After adaptation to standard situation in animal house, rats in experimental group were exposed to Soldering fumes for 1 hour in exposure chamber (0.83m3). Air sampling from the exposure chamber was done daily with two different methods. According to the schedule, tissue specimens were taken from trachea in deep anesthesia. After processing, all samples were sectioned and stained and the thickness of the respiratory epithelium of trachea was measured under light microscopy.Results: There was a significant difference between all of control and experimental subgroups (p<0.000). There was also a significant difference between experimental groups of 6-week subgroup with 2-week subgroup (p<0.001). The amount of the formaldehyde, tin (Sn) and lead (Pb) in gas exposure chamber was 0.193 mg/m3, 0.35 mg/m3 and 3 mg/m3 respectively.Conclusion: It seems that the respiratory epithelium of the trachea responds to the Soldering fumes and the changes in epithelial thickness are time dependent.

This paper introduces a novel Soldering method for joining aluminum foams to aluminum plates. In this method, a rotating aluminum plate is soldered to the aluminum foam using zinc-based solder material. Rotation of the aluminum plate over the solder material drags the solder material and stirring it. Excellent tensile strength was obtained compared to those samples that are welded with the Soldering flux but with no rotation involved. It was concluded that the stirring of the zinc-based solder material in the liquid state and just before the solidification break the oxide layers and help the wetting process done. Scanning electron microscopy examinations showed diffusion has occurred between the solder alloy and the aluminum foam and the aluminum plate.

In this research Soldering property of copper terminal to silver heating circuit of automotive back glass have been investigated. The material of heating circuit is silver, Sn62 Pb36Ag2 Soldering alloy for Soldering heave been used. silver addition to Tin-Lead eutectic solder for 0,0.5,1,1.5,2,2.5 prevent for heating circuit, have done to prevent dissolution of Ag and Soldering time set up in 5,6,7 second. The strength of solder joint when silver percent is less decreased. For decreasing of Soldering heat effect to the glass 7%Bi have been additioned to the solder which decreased the melting point to 173.c. Soldering time also is a major parameter that have been investigated. If Soldering time increased over 5.5 sec. Residual stress cased that glass has broken in zero temperature.

Aim: The aim of this study was to compare tensile strength of pre-solder and post-solder joints for three dental alloys. 45 rods, 32mm in length and 25mm in diameter were made from degubond 4 (Au-Pd-Ag), porson 4 (Pd-Ag) and verabond (ni-Cr-Be).Material and Methods: 15rods for each alloy randomly divided in to three groups of control, presolder and postsolder.10 rods of each alloy were cut in half with a custom made cutting Jig and then positioned and stabilized at 13mm gap distance in an indexing Jig. Rods of deubond 4 and porson 4 were given a heat treatment to simulate porcelain firing. Specimens were soldered with manufacturers recommended solder with gas-oxygen torch (pre-Soldering). Verabond specimens were soldered with gold and base-metal solder. Tensile testing was done on an instron machine. Model AB 725-AM.SM.At cross head speed of 2mm1min and result were recorded in kilogram.Results: 1- For Degubond 4, techniques of Soldering has no sigificant effect on tensile strength of solderjoints.2- For Porson 4, tensile strength of presolder joints is significantly stronger than post-solder joints.3- The tensile strength of presolder joints for degubond 4 and porson 4 are significantly stronger than verabond.Conclusion: Tensile strength of solder joints depends on different factors such as type of alloy and Soldering technique however this is not dearly predictable.

This study investigated the effects of temperature on the wave Soldering of printed circuit boards (PCBs) using three-dimensional finite volume analysis. A computational solder pot model consisting of a six-blade rotational propeller was developed and meshed using tetrahedral elements. The leaded molten solder (Sn63Pb37) distribution and PCB wetting profile were determined using the volume of fluid technique in the fluid flow solver, FLUENT. In this study, the effects of five different molten solder temperatures (456 K, 473 K, 523 K, 583 K, and 643 K) on the wave Soldering of a 70 mm × 146 mm PCB were considered. The effects of temperature on wetting area, wetting profile, velocity vector, and full wetting time were likewise investigated. Molten solder temperature significantly affected the wetting time and distribution of PCBs. The molten solder temperature at 523 K demonstrated desirable wetting distribution and yielded a stable fountain profile and was therefore considered the best temperature in this study. The simulation results were substantiated by the experimental results.

Introduction: Soldering has several applications in prosthodontic treatments; however, the effect of Soldering on porcelain to metal bond strength has not been adequately studied. This study was designed to assess the bond strength of porcelain to metal, and the mode of failure at the soldered and non-soldered areas of cubic specimens. Materials & Methods: In this in vitro, experimental study, 40 porcelain-metal specimens were fabricated under similar conditions and divided into two groups (n=20). In the test group, a hole was created at the center of the frame and was then soldered and veneered with porcelain. The second group was considered as a control group. The bond strength was measured at the center of the specimen using the 3-point bending test in a universal testing machine with a crosshead speed of 0. 5 mm/min. The mean force required for debonding was determined. Photographs of the specimens were digitalized by a scanner and magnified on a computer screen with x10. 5 magnification. Next, each image was divided into 100 squares (1×1 mm). The mode of failure was determined for each specimen. The two groups were compared using independent t-test (p-value˂ 0. 05). Results: The mean porcelain-metal bond strength was 36. 6± 7. 3 N for the soldered and 37. 4± 4. 6 N for the non-soldered group with no significant difference between them (P>0. 05). The mode of failure was cohesive in all specimens in both groups with no significant difference between them (P>0. 05). Conclusion: Within the limitations of this study, the soldered and non-soldered specimens showed no significant difference regarding the porcelain-metal bond strength.

Introduction: Regarding the numerous problems of solderers in electronic industries because of their exposure to Acids, bases and fumes of Soldering ,a study was carried out on107 solderers and administrative personels of a factory producing electronic appliances in Tehran to inspect the long term effects of Soldering on lung functions Inspection. Methods: At first ,47 solderers and 66 controls (totally 107 persons )were selected randomly. All the solderers were working in the manual Soldering section and used the Soldering wire made of an alloy (composed of plumbum, Stannum and special oil of Soldering called flux ). The persons controls worked in the administrative sections of the same factory and for the same hours as the solderers , but they did not have any Soldering experience. After they filled the standard respiratory questionnaire , spirometry was done at least 3 times on each of them under the same conditions and according to the ACT criteria (No smokers included in the study) Results:The spirometry parameters of the two groups were compared . There was a significant difference in the average FEF 25 : 75% (P=0.03).Also ,there was a significant difference in the average FEV1/FVC P=0.026 and PEFR (P=0.04)between two groups .After controling the altering age factor . ameaningful relation between the years of work in Soldering section and decrease in the spirometry parameters related to FED 25-75% and FEV1/FVC was seem . Also . the frequency of the signs of nasal and eyes initation in the solderer group was more than the other group (p=0.007) Cough and Asthma related to ork had no meaningful difference in the two groups . Conclsion :It seem that in the above study , Soldering is a factor decreasing the spirometry parameters with a blocking pattern , especilly in smal airways . This study was done in the direction of the former studies done in other countries and emphasizes on the need for necessary preventive action in this profession , uch as effective local ventilation and use of alternative substances .