مرکز اطلاعات علمی Scientific Information Database (SID) - Trusted Source for Research and Academic Resources

Persian Verion

مرکز اطلاعات علمی Scientific Information Database (SID) - Trusted Source for Research and Academic Resources

video

مرکز اطلاعات علمی Scientific Information Database (SID) - Trusted Source for Research and Academic Resources

sound

مرکز اطلاعات علمی Scientific Information Database (SID) - Trusted Source for Research and Academic Resources

Persian Version

مرکز اطلاعات علمی Scientific Information Database (SID) - Trusted Source for Research and Academic Resources

View:

2,091
مرکز اطلاعات علمی Scientific Information Database (SID) - Trusted Source for Research and Academic Resources

Download:

0
مرکز اطلاعات علمی Scientific Information Database (SID) - Trusted Source for Research and Academic Resources

Cites:

Information Journal Paper

Title

INVESTIGATING FORMATION OF INTERMETALLICS IN COMPOUND CASTING OF AL/CU BIMETALS

Pages

  115-129

Abstract

 The purpose of this article is to study the formation of intermetallic compounds (IMCs) at the interface of Al/Cu bimetal produced by COMPOUND CASTING of molten Al in solid copper tubes. The mechanism of the intermetallic compounds formations at the interface, the effects of molten aluminum pouring temperature and solid copper tubes preheating tempreture, were investigated on the IMCs type and thickness and Al/Cu interface microstructures were characterized by optical microscope (OM) and electron probe micro-analyzer (EPMA). Results show that the interface consists of three main layers, where Layer (I) is a-Al/Al2Cu eutectic structure, layer (II) is intermetal of Al2Cu and layer (III) constituites several intermetallic compounds such as AlCu, Al3Cu4, Al2Cu3 and Al4Cu9. Considering the components of hypereutectic melt at the interface, initially layer (II) was formed by q phase nucleation and growth mechanism, then layer (I) was formed by Al and Cu dissolving and solidification. Finally layer (III) was formed by solid-state phase diffusion. Raising molten Al temperature and preheating solid Cu leads to increase of the intermetallic compounds thickness at interface which consequently increases the specific electrical resistance and decreases the Al/Cu BOND STRENGTH. From experimental results it seems that the BOND STRENGTH is affected by the thicknesses of layer II and III.

Cites

  • No record.
  • References

  • No record.
  • Cite

    APA: Copy

    TAVASSOLI, S., ABBASI, M., & TAHAVVORI, R.. (2016). INVESTIGATING FORMATION OF INTERMETALLICS IN COMPOUND CASTING OF AL/CU BIMETALS. ADVANCED MATERIALS IN ENGINEERING (ESTEGHLAL), 35(2), 115-129. SID. https://sid.ir/paper/163299/en

    Vancouver: Copy

    TAVASSOLI S., ABBASI M., TAHAVVORI R.. INVESTIGATING FORMATION OF INTERMETALLICS IN COMPOUND CASTING OF AL/CU BIMETALS. ADVANCED MATERIALS IN ENGINEERING (ESTEGHLAL)[Internet]. 2016;35(2):115-129. Available from: https://sid.ir/paper/163299/en

    IEEE: Copy

    S. TAVASSOLI, M. ABBASI, and R. TAHAVVORI, “INVESTIGATING FORMATION OF INTERMETALLICS IN COMPOUND CASTING OF AL/CU BIMETALS,” ADVANCED MATERIALS IN ENGINEERING (ESTEGHLAL), vol. 35, no. 2, pp. 115–129, 2016, [Online]. Available: https://sid.ir/paper/163299/en

    Related Journal Papers

    Related Seminar Papers

  • No record.
  • Related Plans

  • No record.
  • Recommended Workshops






    Move to top
    telegram sharing button
    whatsapp sharing button
    linkedin sharing button
    twitter sharing button
    email sharing button
    email sharing button
    email sharing button
    sharethis sharing button