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Information Journal Paper

Title

INTERPARTICLE BOND FORMATION DURING SINTERING OF CU-10SN-10PB FROM MIXED POWDER

Pages

  29-38

Abstract

 In this research, interparticle bond formation in POWDER METALLURGY CU-10SN-10PB ALLOY from mixed powder was investigated. For this purpose Cu, Sn and Pb powders with particle size less than 100 mm were mixed according to the above weight ratio and the prepared powder was compacted at 550 MPa. The compacted samples were sintered in the range of 750 to 800oC, obtained through thermal analysis, for 60 min in Argon atmosphere. Comparing metallographic results and fracture surfaces, the amount of liquid phase, either transient or persistence, was sududied. More homogeneity, in consequence of rearrangement and diffusion of produced liquid phase, was acheived with increasing sintering temperature. Therefore the interparticle bond strength was comparable with particles strength so that TRANSGRANULAR FRACTURE participates more than INTERGRANULAR FRACTURE.

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    APA: Copy

    GHORBANIAN AGHDAM, BAHARAK, & AZADBEH, MAZIAR. (2013). INTERPARTICLE BOND FORMATION DURING SINTERING OF CU-10SN-10PB FROM MIXED POWDER. ADVANCED PROCESSES IN MATERIALS, 6(4 (23)), 29-38. SID. https://sid.ir/paper/172765/en

    Vancouver: Copy

    GHORBANIAN AGHDAM BAHARAK, AZADBEH MAZIAR. INTERPARTICLE BOND FORMATION DURING SINTERING OF CU-10SN-10PB FROM MIXED POWDER. ADVANCED PROCESSES IN MATERIALS[Internet]. 2013;6(4 (23)):29-38. Available from: https://sid.ir/paper/172765/en

    IEEE: Copy

    BAHARAK GHORBANIAN AGHDAM, and MAZIAR AZADBEH, “INTERPARTICLE BOND FORMATION DURING SINTERING OF CU-10SN-10PB FROM MIXED POWDER,” ADVANCED PROCESSES IN MATERIALS, vol. 6, no. 4 (23), pp. 29–38, 2013, [Online]. Available: https://sid.ir/paper/172765/en

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