THE EFFECT OF SUBSTRATE PREPARATION AND THE PEAK CURRENT DENSITY IN PULSE PLATING OF CU-SICN ANOCOMPOSITE COATING SON MORPHOLOGY, GRAIN SIZE, POROSITY, HARDNESS AND CORROSION PROPERTIES

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MIRSAEEDGHAZI S.M.; ALLAHKARAM S.R.

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Paper Information

Journal: JOURNAL OF ADVANCED MATERIALS AND TECHNOLOGIES Year:2014 | Volume:3 | Issue:2 Page(s): 27-35

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Title

THE EFFECT OF SUBSTRATE PREPARATION AND THE PEAK CURRENT DENSITY IN PULSE PLATING OF CU-SICN ANOCOMPOSITE COATING SON MORPHOLOGY, GRAIN SIZE, POROSITY, HARDNESS AND CORROSION PROPERTIES

Author(s)

MIRSAEEDGHAZI S.M. | ALLAHKARAM S.R. | Issue Writer Certificate

Keywords

COPPERQ2

SILICON CARBIDEQ2

POROSITYQ2

SURFACE PREPARATIONQ2

CORROSIONQ2

COMPOSITEQ2

Abstract

COPPER is widely used in different industries due to its good thermal and electrical conductivity. However, it can be in contact with fluid environments in these applications and thus, its CORROSION properties are also important. In this study, COPPER/silicon carbide nano-composite coatings were deposited on COPPER substrates from sulfate bath by pulsed current and different current densities. The effects of COPPER SURFACE PREPARATION and current density on grain size, morphology, hardness, POROSITY, and CORROSION properties of the coatings were investigated. Results revealed that, SURFACE PREPARATION before electrode position leaded to more uniform and less defective coatings. Grain size and POROSITY percent were decreased by increasing of current density. However, incorporation of nano-particles was also decreased by increasing of current density. Therefore, the optimum peak current density was achieved at 12A.dm-2at whichthe highest micro-hardness and the lowest CORROSION rate of the coatingsrespectively193 Hv and 0.008mA/cm2 obtained.

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APA: Copy

MIRSAEEDGHAZI, S.M., & ALLAHKARAM, S.R.. (2014). THE EFFECT OF SUBSTRATE PREPARATION AND THE PEAK CURRENT DENSITY IN PULSE PLATING OF CU-SICN ANOCOMPOSITE COATING SON MORPHOLOGY, GRAIN SIZE, POROSITY, HARDNESS AND CORROSION PROPERTIES. JOURNAL OF ADVANCED MATERIALS AND TECHNOLOGIES, 3(2), 27-35. SID. https://sid.ir/paper/252329/en

Vancouver: Copy

MIRSAEEDGHAZI S.M., ALLAHKARAM S.R.. THE EFFECT OF SUBSTRATE PREPARATION AND THE PEAK CURRENT DENSITY IN PULSE PLATING OF CU-SICN ANOCOMPOSITE COATING SON MORPHOLOGY, GRAIN SIZE, POROSITY, HARDNESS AND CORROSION PROPERTIES. JOURNAL OF ADVANCED MATERIALS AND TECHNOLOGIES[Internet]. 2014;3(2):27-35. Available from: https://sid.ir/paper/252329/en

IEEE: Copy

S.M. MIRSAEEDGHAZI, and S.R. ALLAHKARAM, “THE EFFECT OF SUBSTRATE PREPARATION AND THE PEAK CURRENT DENSITY IN PULSE PLATING OF CU-SICN ANOCOMPOSITE COATING SON MORPHOLOGY, GRAIN SIZE, POROSITY, HARDNESS AND CORROSION PROPERTIES,” JOURNAL OF ADVANCED MATERIALS AND TECHNOLOGIES, vol. 3, no. 2, pp. 27–35, 2014, [Online]. Available: https://sid.ir/paper/252329/en

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