Effect of bonding time on microstructure and completion of isotherm solidification during TLP bonding of dissimilar nickel base superalloys IN738LC and Nimonic 75

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Khakian Ghomi Meysam; Shahriari Mohammad Saeid; nategh saeid

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Journal Paper

Paper Information

Journal: Journal of Advanced Processes in Materials Engineering Year:2021 | Volume:15 | Issue:2 (57) Page(s): 13-25

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Information Journal Paper

Title

Effect of bonding time on microstructure and completion of isotherm solidification during TLP bonding of dissimilar nickel base superalloys IN738LC and Nimonic 75

Author(s)

Khakian Ghomi Meysam | Shahriari Mohammad Saeid | nategh saeid | Issue Writer Certificate

Keywords

Inconel 738 and Nimonic 75Q1

Nickel Base SuperalloysQ1

Transient Liquid Phase BondingQ2

MicrostructureQ1

Isotherm SolidificationQ1

Abstract

Joining of Inconel 738 and Nimonic 75 Nickel Base Superalloys using Ni-Cr-Bcontaining interlayer, MBF-80, performed by transient liquid phase process (TLP) at 1080, 1120, 1150 and 1180° C and different times. Bonding Microstructure was studied using a scanning electron microscope (SEM) and a light microscope. Microstructural studies showed that in short bonding time, the Microstructure consists of continuous eutectic intermetallic phases in the center line of the joint and with increasing bonding time at constant temperature, eutectic intermetallic phases gradually decrease from the bonding and finally completely disappear. In order to predict the time required to Isotherm Solidification completion, Fick’ s diffusion equations were used and it was observed that there is a good agreement between the predicted time of Isotherm Solidification completion and experimental results.

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APA: Copy

Khakian Ghomi, Meysam, Shahriari, Mohammad Saeid, & nategh, saeid. (2021). Effect of bonding time on microstructure and completion of isotherm solidification during TLP bonding of dissimilar nickel base superalloys IN738LC and Nimonic 75. ADVANCED PROCESSES IN MATERIALS, 15(2 (57) ), 13-25. SID. https://sid.ir/paper/375032/en

Vancouver: Copy

Khakian Ghomi Meysam, Shahriari Mohammad Saeid, nategh saeid. Effect of bonding time on microstructure and completion of isotherm solidification during TLP bonding of dissimilar nickel base superalloys IN738LC and Nimonic 75. ADVANCED PROCESSES IN MATERIALS[Internet]. 2021;15(2 (57) ):13-25. Available from: https://sid.ir/paper/375032/en

IEEE: Copy

Meysam Khakian Ghomi, Mohammad Saeid Shahriari, and saeid nategh, “Effect of bonding time on microstructure and completion of isotherm solidification during TLP bonding of dissimilar nickel base superalloys IN738LC and Nimonic 75,” ADVANCED PROCESSES IN MATERIALS, vol. 15, no. 2 (57) , pp. 13–25, 2021, [Online]. Available: https://sid.ir/paper/375032/en

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