CURING BEHAVIOUR OF POLYCYANATE ESTER/O-CRESOL FORMALDEHYDE EPOXY RESIN COMPOSITE SYSTEM

Q: How can I download an article?

To download an article from SID, first log in to the site, search for the article title, and click on the 'Download Article' option.

Q: How can I download an ISI article?

To download an ISI article on SID, enter the keyword or article title in the search bar, view the relevant results, click on the desired article, and select the 'Download Article' option.

Q: How can I access the SID database?

To access the SID database, visit SID.ir, create an account, and log in to access scientific resources.

Q: Is downloading articles from SID free?

Some articles on SID are available for free, while others require payment. Details are specified on the article's page.

PI P.; LIN W.; ZHENG D.; WANG ZH.; WENG X.; CHENG J.; YANG ZH.

مرکز اطلاعات علمی Scientific Information Database (SID) - Trusted Source for Research and Academic Resources

Journal Paper

Paper Information

Journal: Iranian Polymer Journal Year:2010 | Volume:19 | Issue:6 (120) Page(s): 469-477

Download Full-Text

View:

336

Download:

176

Cites:

Information Journal Paper

Title

CURING BEHAVIOUR OF POLYCYANATE ESTER/O-CRESOL FORMALDEHYDE EPOXY RESIN COMPOSITE SYSTEM

Author(s)

Keywords

PCE/OCFEP COMPOSITE SYSTEM

CURING KINETICS

CURING PROCESS

DSC/TG ANALYSIS

KISSINGER METHOD

Abstract

In recent years, the application of high-density multi-layer circuit boards in electronic products has put forward more set of requirements, especially on the thermal stability of the insulation ink, as the key material in the manufacturing of printed circuit board (PCB). Both o-cresol formaldehyde epoxy (OCFEP) and cyanate ester (CE) resins show outstanding thermal stability for application in PCB. In this work, cyanate prepolymer (PCE) and a PCE/OCFEP COMPOSITE SYSTEM were prepared. The curing behaviour of cyanate prepolymer/o-cresol formaldehyde epoxy resin system was studied with non-isothermal differential scanning calorimetry (DSC). Combined with the application requirement, the CURING PROCESS of the system was determined as: 130°C/1h+140°C/1h+180°C/1h. The DSC results also revealed that the apparent activation energy of curing reaction was 83.22, 66.32 and 78.48 kJ/mol when PCE content was 80, 60 and 40 wt%, respectively. This indicates that there was an optimal proportion of PCE and OCFEP in the system. The CURING KINETICS followed the first order reaction. Theoretical analysis on the curing proccess of the system with 60 wt% PCE showed that the thermal stability increased with increased post-processing temperature. This study could provide some guides and basic data for the development of insulation ink for high-density multi-layer printed circuit boards.

Cites

No record.

References

No record.

Cite

APA: Copy

PI, P., LIN, W., ZHENG, D., WANG, ZH., WENG, X., CHENG, J., & YANG, ZH.. (2010). CURING BEHAVIOUR OF POLYCYANATE ESTER/O-CRESOL FORMALDEHYDE EPOXY RESIN COMPOSITE SYSTEM. IRANIAN POLYMER JOURNAL (ENGLISH), 19(6 (120)), 469-477. SID. https://sid.ir/paper/563634/en

Vancouver: Copy

PI P., LIN W., ZHENG D., WANG ZH., WENG X., CHENG J., YANG ZH.. CURING BEHAVIOUR OF POLYCYANATE ESTER/O-CRESOL FORMALDEHYDE EPOXY RESIN COMPOSITE SYSTEM. IRANIAN POLYMER JOURNAL (ENGLISH)[Internet]. 2010;19(6 (120)):469-477. Available from: https://sid.ir/paper/563634/en

IEEE: Copy

P. PI, W. LIN, D. ZHENG, ZH. WANG, X. WENG, J. CHENG, and ZH. YANG, “CURING BEHAVIOUR OF POLYCYANATE ESTER/O-CRESOL FORMALDEHYDE EPOXY RESIN COMPOSITE SYSTEM,” IRANIAN POLYMER JOURNAL (ENGLISH), vol. 19, no. 6 (120), pp. 469–477, 2010, [Online]. Available: https://sid.ir/paper/563634/en

Related Journal Papers

No record.

Related Seminar Papers

No record.

Related Plans

No record.

Recommended Workshops