METALIZATION OF POLYMERS: COPPER ON CYCLOTENE

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SADOUGH-VANINI A.

مرکز اطلاعات علمی Scientific Information Database (SID) - Trusted Source for Research and Academic Resources

Journal Paper

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Journal: ESTEGHLAL Year:2003 | Volume:22 | Issue:1 Page(s): 167-167

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Information Journal Paper

Title

METALIZATION OF POLYMERS: COPPER ON CYCLOTENE

Author(s)

SADOUGH-VANINI A. | Issue Writer Certificate

Keywords

METALIZATIONQ4

CYCLOTENEQ4

ADHERENCEQ2

PLASMAQ2

MULTI-LAYEQ3

Abstract

Abstract: An analysis of the demands of ULSI and GSI technologies shows the ‎necessity of MULTI-LAYEr devices to reduction of signal transmission delay time. This ‎reduction is realized by using a better conductor metal, such as Cu and a surrounding ‎insulator with low capacity than actually used, such as Dow CYCLOTENE 3022. In this ‎paper, the results of evaporated and sputtered Cu to Dow CYCLOTENE 3022 were ‎studied .After presentation of interfacial reaction that causes ADHERENCE; the methods ‎of enhanced ADHERENCE as surface modification of polymer by nitrogen PLASMA have ‎been investigated

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APA: Copy

SADOUGH-VANINI, A.. (2003). METALIZATION OF POLYMERS: COPPER ON CYCLOTENE. ESTEGHLAL, 22(1), 167-167. SID. https://sid.ir/paper/6100/en

Vancouver: Copy

SADOUGH-VANINI A.. METALIZATION OF POLYMERS: COPPER ON CYCLOTENE. ESTEGHLAL[Internet]. 2003;22(1):167-167. Available from: https://sid.ir/paper/6100/en

IEEE: Copy

A. SADOUGH-VANINI, “METALIZATION OF POLYMERS: COPPER ON CYCLOTENE,” ESTEGHLAL, vol. 22, no. 1, pp. 167–167, 2003, [Online]. Available: https://sid.ir/paper/6100/en

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