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Information Journal Paper

Title

COMPUTATIONAL SIMULATION OF TWO-DIMENSIONAL TURBULENT FILM COOLING, USING LES APPROACH AND CONSIDERING DENSITY RATIO EFFECTS

Pages

  91-103

Keywords

LARGE EDDY SIMULATION (LES)Q2

Abstract

 Film cooling of a two-dimensional flat plate at different jet to cross flow velocity ratios (R) is simulated at the jet Reynolds number of 4700, using large eddy simulation (LES) approach. Our computational methodology includes the use of finite volume method, applying the unsteady SIMPLE algorithm and a multi-block and non-uniform staggered grid. The governing equations have been discretized applying the Power-Law scheme for the spatial terms and the Crank-Nicholson scheme for the temporal terms. Two solution approaches are discussed here, namely: 1-neglecting and 2-considering DENSITY RATIO effects. The results showed that the DENSITY RATIO has significant effects on the flow structures, namely on the penetration, the expansion, and the reattachment point of the vortical regions. Therefore, it changes the temperature distribution and the FILM COOLING EFFECTIVENESS, and thus, it should not be easily neglected.

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    APA: Copy

    RAMEZANIZADEH, M., SAEIDI, M.H., & TAYEBI RAHNI, M.. (2007). COMPUTATIONAL SIMULATION OF TWO-DIMENSIONAL TURBULENT FILM COOLING, USING LES APPROACH AND CONSIDERING DENSITY RATIO EFFECTS. AEROSPACE MECHANICS JOURNAL, 3(1), 91-103. SID. https://sid.ir/paper/101714/en

    Vancouver: Copy

    RAMEZANIZADEH M., SAEIDI M.H., TAYEBI RAHNI M.. COMPUTATIONAL SIMULATION OF TWO-DIMENSIONAL TURBULENT FILM COOLING, USING LES APPROACH AND CONSIDERING DENSITY RATIO EFFECTS. AEROSPACE MECHANICS JOURNAL[Internet]. 2007;3(1):91-103. Available from: https://sid.ir/paper/101714/en

    IEEE: Copy

    M. RAMEZANIZADEH, M.H. SAEIDI, and M. TAYEBI RAHNI, “COMPUTATIONAL SIMULATION OF TWO-DIMENSIONAL TURBULENT FILM COOLING, USING LES APPROACH AND CONSIDERING DENSITY RATIO EFFECTS,” AEROSPACE MECHANICS JOURNAL, vol. 3, no. 1, pp. 91–103, 2007, [Online]. Available: https://sid.ir/paper/101714/en

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