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Information Journal Paper

Title

TLP Bonding of Al-Al V Nano Composite and Evaluation of its Properties

Pages

  27-40

Abstract

 In this research, the bonding of aluminum matrix nanocomposites reinforced by Al V particles was investigated using a transient liquid phase of bonding process and evaluating its properties. The effect of temperature and time of bonding on the properties was also investigated. For this purpose, Al-Al V nanocomposite components were first prepared for bonding. The copper metal was used as the intermediate layer and bonding of these components was investigated by the transient liquid phase method at, and C, and, and min. Scanning electron microscopy was used to evaluate the microstructure of the joint. The shear strength of the joints was also evaluated by a pressure test device. The results indicated better bonding at and °, C than other samples. With increasing bonding temperature, the melt volume increased at the bonding joint and thus a wider surface area is filled by melt. According to the microhardness results, the maximum hardness of the joint is at °,C for min due to the diffusion of copper and formation of Al Cu precipitated particles around the joint seam. The maximum joint shear strength of MPa was achieved at °,C for min.

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  • Cite

    APA: Copy

    Anvari, Seyedh Zahra, Rajabi, Mahdi, & Oshaghi, Safora. (2023). TLP Bonding of Al-Al V Nano Composite and Evaluation of its Properties. ADVANCED PROCESSES IN MATERIALS, 16(4 (63) ), 27-40. SID. https://sid.ir/paper/1067334/en

    Vancouver: Copy

    Anvari Seyedh Zahra, Rajabi Mahdi, Oshaghi Safora. TLP Bonding of Al-Al V Nano Composite and Evaluation of its Properties. ADVANCED PROCESSES IN MATERIALS[Internet]. 2023;16(4 (63) ):27-40. Available from: https://sid.ir/paper/1067334/en

    IEEE: Copy

    Seyedh Zahra Anvari, Mahdi Rajabi, and Safora Oshaghi, “TLP Bonding of Al-Al V Nano Composite and Evaluation of its Properties,” ADVANCED PROCESSES IN MATERIALS, vol. 16, no. 4 (63) , pp. 27–40, 2023, [Online]. Available: https://sid.ir/paper/1067334/en

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