Information Journal Paper
APA:
CopyMOTIEI FAR, A., & RASHIDIAN, B.. (2003). SI/SI, SI/SIO2 AND SIO2/SIO2 FUSION WAFER BONDING. SCIENTIA IRANICA, 10(4), 477-480. SID. https://sid.ir/paper/289517/en
Vancouver:
CopyMOTIEI FAR A., RASHIDIAN B.. SI/SI, SI/SIO2 AND SIO2/SIO2 FUSION WAFER BONDING. SCIENTIA IRANICA[Internet]. 2003;10(4):477-480. Available from: https://sid.ir/paper/289517/en
IEEE:
CopyA. MOTIEI FAR, and B. RASHIDIAN, “SI/SI, SI/SIO2 AND SIO2/SIO2 FUSION WAFER BONDING,” SCIENTIA IRANICA, vol. 10, no. 4, pp. 477–480, 2003, [Online]. Available: https://sid.ir/paper/289517/en