Effect of bonding temperature on microstructure and intermetallic compound formation of diffusion Bonded Mg/Al joints

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Amar Mofid Mohamad; Hajian Heidary Mostafa; Loryaei Ehsan; Shakeri Hatef

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Journal: Journal of Advanced Processes in Materials Engineering Year:2020 | Volume:14 | Issue:1 Page(s): 85-95

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Title

Effect of bonding temperature on microstructure and intermetallic compound formation of diffusion Bonded Mg/Al joints

Author(s)

Amar Mofid Mohamad | Hajian Heidary Mostafa | Loryaei Ehsan | Shakeri Hatef | Issue Writer Certificate

Keywords

Diffusion BondQ1

Al AlloyQ2

Mg AlloyQ1

InterfaceQ2

MicrostructureQ2

IntermetallicQ2

Abstract

The Diffusion Bonding of two dissimilar alloys Al 5083 and Mg AZ31 was carried out at 420, 430. 440 and 450 ° C for bonding time of 60 min. In order to characterize the Microstructure evolution in the joint zone, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) were applied. The results show that joint formation is attributed to the solid-state diffusion of Mg and Al into Al 5083 and Mg AZ31 alloys followed by eutectic formation and constitutional liquation along the Interface. At bonding temperature of 430° C diffusion induced grain coarsening was observed at the Interface. With increase in bonding temperature, the atomic diffusivity increases, results in easier and speeder chemical bonding. In bonding temperature of 440° C the weld had an irregular shaped region in the weld center, having a different Microstructure from the two base materials. The irregular shaped region contained a large volume of Intermetallic compound Al12Mg17 and showed significantly higher hardness in the weld center. The present study suggests that constitutional liquation resulted in the Intermetallic compound Al12Mg17 in the weld center.

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APA: Copy

Amar Mofid, Mohamad, Hajian Heidary, Mostafa, Loryaei, Ehsan, & Shakeri, Hatef. (2020). Effect of bonding temperature on microstructure and intermetallic compound formation of diffusion Bonded Mg/Al joints. ADVANCED PROCESSES IN MATERIALS, 14(1 ), 85-95. SID. https://sid.ir/paper/399649/en

Vancouver: Copy

Amar Mofid Mohamad, Hajian Heidary Mostafa, Loryaei Ehsan, Shakeri Hatef. Effect of bonding temperature on microstructure and intermetallic compound formation of diffusion Bonded Mg/Al joints. ADVANCED PROCESSES IN MATERIALS[Internet]. 2020;14(1 ):85-95. Available from: https://sid.ir/paper/399649/en

IEEE: Copy

Mohamad Amar Mofid, Mostafa Hajian Heidary, Ehsan Loryaei, and Hatef Shakeri, “Effect of bonding temperature on microstructure and intermetallic compound formation of diffusion Bonded Mg/Al joints,” ADVANCED PROCESSES IN MATERIALS, vol. 14, no. 1 , pp. 85–95, 2020, [Online]. Available: https://sid.ir/paper/399649/en

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