Information Journal Paper
APA:
CopyTAVALAEI, H.A., & GHALANDARZADEH, S.. (2003). SEMIPRIME SUBMODULES AND ENVELOPE OF MODULES. INTERNATIONAL JOURNAL OF ENGINEERING SCIENCE (ENGLISH), 14(4), 131-142. SID. https://sid.ir/paper/528676/en
Vancouver:
CopyTAVALAEI H.A., GHALANDARZADEH S.. SEMIPRIME SUBMODULES AND ENVELOPE OF MODULES. INTERNATIONAL JOURNAL OF ENGINEERING SCIENCE (ENGLISH)[Internet]. 2003;14(4):131-142. Available from: https://sid.ir/paper/528676/en
IEEE:
CopyH.A. TAVALAEI, and S. GHALANDARZADEH, “SEMIPRIME SUBMODULES AND ENVELOPE OF MODULES,” INTERNATIONAL JOURNAL OF ENGINEERING SCIENCE (ENGLISH), vol. 14, no. 4, pp. 131–142, 2003, [Online]. Available: https://sid.ir/paper/528676/en