Information Journal Paper
APA:
CopyGHASEMI, SEYED EBRAHIM. (2017). EXPERIMENTAL AND NUMERICAL INVESTIGATION OF CIRCULAR MINICHANNEL HEAT SINKS WITH VARIOUS HYDRAULIC DIAMETER FOR ELECTRONIC COOLING APPLICATION. MICROELECTRONICS RELIABILITY, 73(-), 97-105. SID. https://sid.ir/paper/713768/en
Vancouver:
CopyGHASEMI SEYED EBRAHIM. EXPERIMENTAL AND NUMERICAL INVESTIGATION OF CIRCULAR MINICHANNEL HEAT SINKS WITH VARIOUS HYDRAULIC DIAMETER FOR ELECTRONIC COOLING APPLICATION. MICROELECTRONICS RELIABILITY[Internet]. 2017;73(-):97-105. Available from: https://sid.ir/paper/713768/en
IEEE:
CopySEYED EBRAHIM GHASEMI, “EXPERIMENTAL AND NUMERICAL INVESTIGATION OF CIRCULAR MINICHANNEL HEAT SINKS WITH VARIOUS HYDRAULIC DIAMETER FOR ELECTRONIC COOLING APPLICATION,” MICROELECTRONICS RELIABILITY, vol. 73, no. -, pp. 97–105, 2017, [Online]. Available: https://sid.ir/paper/713768/en