EXPERIMENTAL EVALUATION OF COOLING PERFORMANCE OF CIRCULAR HEAT SINKS FOR HEAT DISSIPATION FROM ELECTRONIC CHIPS USING NANOFLUID, MECHANICS RESEARCH COMMUNICATIONS

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GHASEMI SEYED EBRAHIM

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Journal Paper

Paper Information

Journal: JOURNAL OF MECHANICS RESEARCH COMMUNICATIONS Year:2017 | Volume:84 | Issue:- Page(s): 85-89

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Title

EXPERIMENTAL EVALUATION OF COOLING PERFORMANCE OF CIRCULAR HEAT SINKS FOR HEAT DISSIPATION FROM ELECTRONIC CHIPS USING NANOFLUID, MECHANICS RESEARCH COMMUNICATIONS

Author(s)

GHASEMI SEYED EBRAHIM | Issue Writer Certificate

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Abstract

Cites

COOLING PERFORMANCE ANALYSIS OF WATER-COOLED HEAT SINKS WITH CIRCULAR AND RECTANGULAR MINICHANNELS USING FINITE VOLUME METHOD

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APA: Copy

GHASEMI, SEYED EBRAHIM. (2017). EXPERIMENTAL EVALUATION OF COOLING PERFORMANCE OF CIRCULAR HEAT SINKS FOR HEAT DISSIPATION FROM ELECTRONIC CHIPS USING NANOFLUID, MECHANICS RESEARCH COMMUNICATIONS. JOURNAL OF MECHANICS RESEARCH COMMUNICATIONS, 84(-), 85-89. SID. https://sid.ir/paper/728283/en

Vancouver: Copy

GHASEMI SEYED EBRAHIM. EXPERIMENTAL EVALUATION OF COOLING PERFORMANCE OF CIRCULAR HEAT SINKS FOR HEAT DISSIPATION FROM ELECTRONIC CHIPS USING NANOFLUID, MECHANICS RESEARCH COMMUNICATIONS. JOURNAL OF MECHANICS RESEARCH COMMUNICATIONS[Internet]. 2017;84(-):85-89. Available from: https://sid.ir/paper/728283/en

IEEE: Copy

SEYED EBRAHIM GHASEMI, “EXPERIMENTAL EVALUATION OF COOLING PERFORMANCE OF CIRCULAR HEAT SINKS FOR HEAT DISSIPATION FROM ELECTRONIC CHIPS USING NANOFLUID, MECHANICS RESEARCH COMMUNICATIONS,” JOURNAL OF MECHANICS RESEARCH COMMUNICATIONS, vol. 84, no. -, pp. 85–89, 2017, [Online]. Available: https://sid.ir/paper/728283/en

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