THE TARGET POISONING IN THE PLASMA REACTIVE DEPOSITION

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MIRZAYE TAGHI; HOSEIN ZAHED

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Seminar Paper

Paper Information

Seminar: NATIONAL VACUUM CONFERENCE IRAN
Year:2012 | Issue:5

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Title

THE TARGET POISONING IN THE PLASMA REACTIVE DEPOSITION

Author(s)

MIRZAYE TAGHI | HOSEIN ZAHED

Keywords

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Abstract

THE INTEREST IN DUSTY PLASMA RESEARCH, WHICH IS A RELATIVELY NEW FIELD IN PLASMA PHYSICS, HAS INCREASED WITH THE DEVELOPMENT OF MICROELECTRONICS AND SURFACE ENGINEERING. THE DUST PARTICLES APPEAR AS POLLUTANT IN THIS INDUSTRIAL PROCESSING. RECENTLY, HOWEVER, THEY ARE SEEN FROM A DIFFERENT POINT OF VIEWS – THEY CAN BE USEFUL IN COATINGS VARIOUS TECHNOLOGIES. ONE THE TYPE OF DEPOSITION IS PLASMA REACTIVE SPUTTERING. THE TARGET POISONING IN THE PROCESSES DEPOSITION FOR REACTIVE SPUTTERING IS IMPORTANT. THE RESULTANT OF TARGET POISONING IS INSTABILITY IN THE SYSTEM. THERE HAVE VERY INFLUENCE ON THE ELECTRICAL, OPTICAL AND CONSTRUCTION PROPERTIES. THE STOCHIOMETRY IS CHANGING ALONG TARGET POISONING.

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APA: Copy

MIRZAYE, TAGHI, & HOSEIN, ZAHED. (2012). THE TARGET POISONING IN THE PLASMA REACTIVE DEPOSITION. NATIONAL VACUUM CONFERENCE IRAN. SID. https://sid.ir/paper/906978/en

Vancouver: Copy

MIRZAYE TAGHI, HOSEIN ZAHED. THE TARGET POISONING IN THE PLASMA REACTIVE DEPOSITION. 2012. Available from: https://sid.ir/paper/906978/en

IEEE: Copy

TAGHI MIRZAYE, and ZAHED HOSEIN, “THE TARGET POISONING IN THE PLASMA REACTIVE DEPOSITION,” presented at the NATIONAL VACUUM CONFERENCE IRAN. 2012, [Online]. Available: https://sid.ir/paper/906978/en

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