Information Journal Paper
APA:
CopyCHEN, W.Q., LIANG, J., & DING, H.J.. (1997). THREE DIMENSIONAL ANALYSIS OF BENDING PROBLEMS OF THICK PIEZOELECTRIC COMPOSITE RECTANGULAR PLATES. ACTA MATERIALE COMPOSITAE SINICA, 14(1), 108-115. SID. https://sid.ir/paper/602552/en
Vancouver:
CopyCHEN W.Q., LIANG J., DING H.J.. THREE DIMENSIONAL ANALYSIS OF BENDING PROBLEMS OF THICK PIEZOELECTRIC COMPOSITE RECTANGULAR PLATES. ACTA MATERIALE COMPOSITAE SINICA[Internet]. 1997;14(1):108-115. Available from: https://sid.ir/paper/602552/en
IEEE:
CopyW.Q. CHEN, J. LIANG, and H.J. DING, “THREE DIMENSIONAL ANALYSIS OF BENDING PROBLEMS OF THICK PIEZOELECTRIC COMPOSITE RECTANGULAR PLATES,” ACTA MATERIALE COMPOSITAE SINICA, vol. 14, no. 1, pp. 108–115, 1997, [Online]. Available: https://sid.ir/paper/602552/en