Information Journal Paper
APA:
CopyMILLER, D., LEE, J., & CHANG, S.. (2009). FILLING THE INSTITUTIONAL VOID: THE SOCIAL BEHAVIOR AND PERFORMANCE OF FAMILY VS. NON-FAMILY TECHNOLOGY FIRMS IN EMERGING MARKETS. JOURNAL OF INTERNATIONAL BUSINESS STUDIES, 40(5), 802-817. SID. https://sid.ir/paper/615992/en
Vancouver:
CopyMILLER D., LEE J., CHANG S.. FILLING THE INSTITUTIONAL VOID: THE SOCIAL BEHAVIOR AND PERFORMANCE OF FAMILY VS. NON-FAMILY TECHNOLOGY FIRMS IN EMERGING MARKETS. JOURNAL OF INTERNATIONAL BUSINESS STUDIES[Internet]. 2009;40(5):802-817. Available from: https://sid.ir/paper/615992/en
IEEE:
CopyD. MILLER, J. LEE, and S. CHANG, “FILLING THE INSTITUTIONAL VOID: THE SOCIAL BEHAVIOR AND PERFORMANCE OF FAMILY VS. NON-FAMILY TECHNOLOGY FIRMS IN EMERGING MARKETS,” JOURNAL OF INTERNATIONAL BUSINESS STUDIES, vol. 40, no. 5, pp. 802–817, 2009, [Online]. Available: https://sid.ir/paper/615992/en