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Information Journal Paper

Title

ANNEALING TEMPERATURE EFFECT ON NANOSTRUCTURE AND PHASE TRANSITION OF COPPER OXIDE THIN FILMS

Pages

  185-190

Abstract

 This paper addresses the ANNEALING TEMPERATURE effect on NANOSTRUCTURE AND PHASE TRANSITION of COPPER OXIDE THIN FILMs, deposited by PVD method on glass substrate (at 110 nm thickness) and post annealed at different temperatures (200-400oC) with a flow of 1 cm3s-1 Oxygen. The X-ray diffraction (XRD) was employed for crystallographic and phase analyses, while atomic force microscopy (AFM) was used for morphology investigation. The results showed (CuO2) cuprite phase for samples annealed at 200 and 250oC and (CuO) tenorite phase for samples annealed at 350 and 400oC, while sample annealed at 300oC had a complex phases (CuO2 and CuO). The size of the grains increased, but roughness increased and then decreased by increasing of ANNEALING TEMPERATURE. Furthermore, calculated activation energy from grain diameter (at arrhenius plot) was 0.54 eV.

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    Cite

    APA: Copy

    KHOJIER, K., & BEHJU, A.. (2012). ANNEALING TEMPERATURE EFFECT ON NANOSTRUCTURE AND PHASE TRANSITION OF COPPER OXIDE THIN FILMS. INTERNATIONAL JOURNAL OF NANO DIMENSION (IJND), 2(3 (7)), 185-190. SID. https://sid.ir/paper/322082/en

    Vancouver: Copy

    KHOJIER K., BEHJU A.. ANNEALING TEMPERATURE EFFECT ON NANOSTRUCTURE AND PHASE TRANSITION OF COPPER OXIDE THIN FILMS. INTERNATIONAL JOURNAL OF NANO DIMENSION (IJND)[Internet]. 2012;2(3 (7)):185-190. Available from: https://sid.ir/paper/322082/en

    IEEE: Copy

    K. KHOJIER, and A. BEHJU, “ANNEALING TEMPERATURE EFFECT ON NANOSTRUCTURE AND PHASE TRANSITION OF COPPER OXIDE THIN FILMS,” INTERNATIONAL JOURNAL OF NANO DIMENSION (IJND), vol. 2, no. 3 (7), pp. 185–190, 2012, [Online]. Available: https://sid.ir/paper/322082/en

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